India now has OSAT lines in production, a 300 mm fab under construction, and a second phase of the India Semiconductor Mission behind them. Every one of those projects is measured against China — the market that added the most capacity, localized the most equipment, and set the prices Indian lines will compete with. ForSilicon publishes that China benchmark.
India’s semiconductor program moved from policy to production in 2026. Packaging and test came first; front-end capacity is next. Both are planned, priced, and staffed against what China already built.
Micron’s Sanand assembly and test plant, Kaynes Semicon, and CG Semi began commercial production in 2026, with more ATMP / OSAT units approved. Our China advanced-packaging research sizes the OSAT capacity, packaging WFE, and customer set they will compete with for global volume.
Tata Electronics and Taiwan’s PSMC are building a 300 mm fab at Dholera, Gujarat. China’s mature-node foundries — SMIC, Hua Hong, Nexchip, and the long tail in our China fabs directory — are the closest live benchmark for how a mature-node line ramps and prices.
The second phase of ISM, approved in July 2026, extends capex support to fabs, advanced packaging, and ATMP. Project and policy teams need a defensible view of where China is adding mature-node and packaging capacity before committing the next round.
Wafers, gases, chemicals, and sub-system components are still largely imported, and China is a major source. ForSEMI Learn adds the hands-on operator, equipment, and process training a new line needs on top of design-focused university programs.
India restricts investment from China and screens Chinese technology closely, and most Indian lines source tools from established global suppliers. We do not pretend otherwise. What we sell is the China capacity, pricing, and localization picture those programs compete with.
China is adding more mature-node and specialty capacity than any other country. Quarterly capacity and utilization data shows where pricing pressure on a new Indian fab will come from — by wafer size, node class, and company.
JCET, Tongfu, Huatian, and China’s advanced-packaging long tail are the competitors India’s OSATs meet for global customers. Our directory and packaging research name them and size their capacity.
Materials and components research shows which wafers, gases, chemicals, and parts China now produces at scale — useful for mapping exposure, pricing, and dual-sourcing in an Indian bill of materials.
India’s talent programs have trained tens of thousands of students in chip design. Fabs and OSAT lines also need operators, equipment technicians, and process engineers — the hands-on curricula ForSEMI Learn runs.
If you are planning capacity, pricing a business case, or standing up a workforce program in India, start with the China research below.
Benchmark capacity ramps, utilization, and WFE spend against China foundries and OSATs before committing the next phase of a line.
See how China’s provinces sequenced fabs, packaging, and talent, and what that build-out actually cost — the comparison set for an Indian cluster.
Use China localization data to understand which competitors your customers in India will benchmark you against on price and lead time.
Start with the monitor or deep-dive that matches the line you are planning, then ask for a localization briefing on the tool and material categories on your list.
The China research those programs buy is collected on the China semiconductor hub →
Need people for the line, not only a supplier map? Explore ForSEMI Learn training →
How governments and greenfield fabs outside China use China WFE, localization, and training data.
Open briefing →China OSAT and supplier intelligence for Malaysia, Thailand, Singapore, the Philippines, and Indonesia.
Open briefing →China WFE, OSAT, and supplier intelligence for Vietnam packaging expansions and first wafer-fab programs.
Open briefing →China fab, equipment, and materials data for Saudi Arabia, the UAE, Qatar, and other GCC manufacturing programs.
Open briefing →India’s first commercial silicon fab, built by Tata Electronics with PSMC at Dholera, Gujarat, is under construction. Assembly and test plants from Micron, Kaynes Semicon, and CG Semi began commercial production in 2026. ForSilicon does not publish an India fab directory; we publish the China capacity, WFE, and packaging data those projects benchmark against.
That is a policy, security, and customer-qualification decision for each project, and Indian lines largely source from established global toolmakers. Our research does not depend on it: Indian teams use China data to benchmark capacity, pricing, and localization, and to map China-origin materials and components already in their supply chain.
Because Chinese OSATs are among the largest competitors for the same global customers. Our advanced-packaging research sizes China’s OSAT capacity, packaging WFE, and 2.5D / 3D and HBM-related demand, and names the companies behind it.
Yes. ForSEMI Learn designs operator, equipment-technician, process, and management programs for employers, universities, and governments. Contact us with the roles and headcount you need and we will send a curriculum outline.
Tell us whether you are planning a fab, an ATMP / OSAT line, a state semiconductor cluster, or a training program in India — we will follow up with China capacity and packaging samples or a ForSEMI Learn outline.
Email us at contact@forsilicon.com