Focus
Independent, third-party research dedicated to China's equipment, materials, and components — not a generalist consultancy.
ForSilicon Research delivers independent, primary-research data on China's wafer manufacturing, advanced packaging, equipment, materials, and components — the intelligence equipment makers, materials firms, and research institutes rely on to judge long-term value.
An independent third-party institute focused exclusively on China's semiconductor equipment, materials, and components — so every decision can rest on data truth you can trust.
Independent, third-party research dedicated to China's equipment, materials, and components — not a generalist consultancy.
A core team with deep experience at TSMC, Hua Hong, HHGrace, AMAT, TEL, LAM, and 3M — sharp, first-hand industry insight.
Full value-chain tracking with standardized and custom deep dives, backed by rich databases and continuous expert engagement.
Long-term, continuous monitoring with forward-looking analysis and timely updates that support sustainable strategy.
Comprehensive quarterly capacity and utilization analysis, plus annual sizing and forecasts for China wafer manufacturing WFE (Wafer Fabrication Equipment) spend — helping equipment, materials, components, and manufacturing support firms understand customers' current WFE scale and future incremental spend for strategy and market development.
Quarterly & annual delivery Learn more →Comprehensive semi-annual capacity and utilization analysis, plus sizing and forecasts for mainland China advanced packaging WFE (Wafer Fabrication Equipment) spend — with market structure and player share insights to support strategic decisions and market development for equipment, materials, and supply-chain partners.
Semi-annual delivery Learn more →Clarify the direction and addressable space of China's furnace equipment market to inform strategic choices. Structured around technology, market, and competitive analysis — covering equipment taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and supplier–customer tool intelligence for equipment firms.
Annual · 2022-2030E horizon Learn more →Clarify the direction and addressable space of China's semiconductor materials market to inform strategic choices. Structured around technology, market, and competitive analysis — covering material taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and supply-chain intelligence for materials firms.
Annual · 2022-2030E horizon Learn more →Clarify the direction and addressable space of China's semiconductor components market to inform strategic choices. Structured around technology, market, and competitive analysis — covering component taxonomy and technical comparison, segment market sizing (2022-2030E), competitive landscape, and equipment-supplier intelligence for components firms.
Annual · 2022-2030E horizon Learn more →Our talent institute, ForSEMI Learn, trains people for wafer fabs, advanced packaging, equipment, materials, and components companies — from a new hire's first week to the director's office, and from a single component to a production tool.
Explore training →In-house technical and management programs, hands-on equipment training, and university training with job placement.
Strategy decoding, technical consulting, market insight, and supplier qualification coaching.
Organization and talent reviews, ODR, and talent pipeline assessment.
Introduction In 3D packaging, there exists a fundamental technical contradiction: the higher the interconnect density, the smaller the bump pitch, and the…
Read the analysis →An integrated network spanning universities, enterprises, media, and capital — the foundation behind our primary research.
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