ForSilicon Research maps mainland China’s wafer fabs, WFE spend, equipment and materials localization, named companies, and advanced packaging — the China semiconductor industry as it actually buys tools, materials, and components. This hub points to the live products, directories, and published capacity series. Subscriptions and analyst briefings are by inquiry, not a self-serve data dump.
Source: ForSilicon Research, June 2025
The public China wafer-capacity series on this site runs from 2015 through 2030F, in kunits per month on an 8-inch-equivalent basis. The 2030F point is 14,800 kunits/month. Those are the same figures charted on the homepage, sourced ForSilicon Research, June 2025. Line-level history, utilization, and WFE sit in the paid wafer-manufacturing monitor.
| Year | Capacity |
|---|---|
| 2015 | 1,300 |
| 2016 | 1,430 |
| 2017 | 1,550 |
| 2018 | 1,800 |
| 2019 | 2,169 |
| 2020 | 2,920 |
| 2021 | 4,000 |
| 2022 | 4,800 |
| 2023 | 5,800 |
| 2024 | 6,930 |
| 2025 | 8,400 |
| 2026F | 9,800 |
| 2027F | 11,250 |
| 2028F | 12,550 |
| 2029F | 13,850 |
| 2030F | 14,800 |
Source: ForSilicon Research, June 2025
Each block is an existing ForSilicon asset — products, directories, insights, or press — not a new forecast.
Cite the published 2015–2030F series: 14,800 kunits/month (8-inch equivalent) in 2030F, 8,400 in 2025, about 5× versus 2020, and 6× domestic versus foreign-invested capacity by 2030F. Use the forecast page for the table and unit note — not a third-party reprint.
Quarterly China foundry and IDM capacity and utilization, plus annual wafer-fabrication-equipment spend, so equipment, materials, and components firms can see which lines are expanding and what they will buy. Related WFE categories — lithography, etch, deposition, CMP, clean, and furnace — are covered in that monitor and as custom work.
Localization research on furnace tools, process materials, and critical components — which Chinese suppliers are production-worthy, and where imports still hold. This is equipment-supplier intelligence for qualification and dual-sourcing, not a parts catalog.
Public directories of named mainland China wafer fabs and OSAT / advanced-packaging companies — English and Chinese names, business models, and links into capacity, WFE, and packaging research. Directory stubs are a company map, not a substitute for the paid databases.
Semi-annual China OSAT and advanced-packaging capacity, utilization, and packaging WFE, alongside the public packaging-company directory. Use both when the question is 2.5D / 3D, hybrid bonding, or which mainland OSATs are adding lines.
ForSilicon is a research institute, not a wire service. Dated China semiconductor analysis lives on Insights; citation and press notes live on the press page. There is no rolling newsroom feed on this site — ask for an analyst briefing if you need a subscription update.
EUV and leading-edge lithography localization is a question clients ask because it sits next to export controls and China WFE. This site does not publish an EUV adoption rate or a timeline. If that is the briefing you need, talk to an analyst — we work from observable China equipment and localization research, not from invented forecasts.
Start with the monitor or deep-dive that matches the China semiconductor question you have, then ask for a sample or localization briefing.
Governments and greenfield fabs in India, Southeast Asia, Vietnam, and the Middle East use the same China semiconductor research to qualify suppliers and benchmark ramps. Those pages are briefings for buyers of China data — they are not a second China capacity series.
How governments and greenfield fabs outside China use China WFE, localization, and training data.
Open briefing →China capacity, OSAT, and localization benchmarks for India’s ISM fab and ATMP / OSAT projects.
Open briefing →China OSAT and supplier intelligence for Malaysia, Thailand, Singapore, the Philippines, and Indonesia.
Open briefing →China WFE, OSAT, and supplier intelligence for Vietnam packaging expansions and first wafer-fab programs.
Open briefing →China fab, equipment, and materials data for Saudi Arabia, the UAE, Qatar, and other GCC manufacturing programs.
Open briefing →Related, and kept on its own page: hands-on manufacturing training at ForSEMI Learn. Research subscriptions and training inquiries are separate conversations. ForSEMI Learn training →
ForSilicon Research covers mainland China wafer-fab capacity and utilization, WFE spend, advanced packaging / OSAT, furnace equipment, materials, and components, plus public directories of China fabs and packaging companies. The public 2015–2030F capacity series is on the wafer-capacity forecast page; line-level data is in the paid monitors. Contact contact@forsilicon.com for a sample or subscription briefing.
Yes — as research, not as a parts catalog. Furnace equipment, materials, and components studies map which domestic suppliers are in production and where imports still hold. Broader WFE categories (lithography, etch, deposition, CMP, clean) are in the wafer-manufacturing monitor and as custom research.
Dated analysis is on Insights. Citation and press notes are on the press page. We do not run a newsroom ticker. For ongoing briefings, talk to an analyst about a research subscription.
The China fabs directory and the China advanced-packaging companies directory are public name maps with English and Chinese variants. They are not a complete capacity database. Detailed capacity, utilization, and WFE sit in the paid products.
No public EUV adoption rate or timeline is published on this site. EUV and lithography localization are briefing topics we will discuss from the WFE and equipment-supplier research we do publish. Contact an analyst if that is the question you need answered.
Tell us whether you need a capacity or WFE sample, a localization briefing, a named-company map, or a subscription conversation — we will follow up from contact@forsilicon.com.
Email us at contact@forsilicon.com