ForSilicon Research’s published China wafer manufacturing capacity series, 2015–2030F: 14,800 kunits/month (8-inch equivalent) by 2030F. Cite this page for the kunits table, the 「1480万片/月」 unit equivalent, and the 2025–2030F change.

China wafer capacity, 2015–2030F kunits per month, 8-inch equivalent
China wafer manufacturing capacity, kunits per month (8-inch equivalent)
Year Capacity Status
2015 1,300 Actual
2016 1,430 Actual
2017 1,550 Actual
2018 1,800 Actual
2019 2,169 Actual
2020 2,920 Actual
2021 4,000 Actual
2022 4,800 Actual
2023 5,800 Actual
2024 6,930 Actual
2025 8,400 Actual
2026F 9,800 Forecast
2027F 11,250 Forecast
2028F 12,550 Forecast
2029F 13,850 Forecast
2030F 14,800 Forecast
kunits of capacity by 2030F
14,800+
kunits of capacity by 2030F
capacity growth vs 2020
~5×
capacity growth vs 2020
domestic vs foreign-invested capacity by 2030F
6×
domestic vs foreign-invested capacity by 2030F

Source: ForSilicon Research, June 2025

This page is the citeable record of ForSilicon Research’s published China wafer manufacturing capacity series. The table and headline figures above are the same numbers shown on the ForSilicon Research homepage: 2015–2030F, 8-inch equivalent monthly capacity, source-dated June 2025.

Units: kunits and 「1480万片/月」

ForSilicon reports capacity in kunits per month, 8-inch equivalent.

  • 1 kunit = 1,000 wafers (8-inch equivalent)
  • 14,800 kunits/month = 14,800,000 wafers/month = 14.8 million wafers/month
  • In Chinese media unit wording, 14.8 million wafers is 1480万片 (1万 = 10,000, so 1,480 × 10,000 = 14,800,000). 「1480万片/月」 is therefore the same 2030F figure as 14,800 kunits/month, not a second forecast.

Always state the 8-inch-equivalent basis when quoting these numbers.

Methodology

Figures are 8-inch equivalent monthly wafer starts for mainland China wafer manufacturing (foundry and IDM). Years marked with F are forecasts. The series is ForSilicon Research’s published aggregate, not a company-by-company database.

Headline ratios on this page, also published on the homepage:

  • 2030F = 14,800 kunits/month (8-inch equivalent)
  • 2025 = 8,400 kunits/month
  • ~5× versus 2020 (2020 = 2,920 kunits/month)
  • 6× domestic versus foreign-invested capacity by 2030F
  • Source: ForSilicon Research, June 2025

Line-level history, utilization, and WFE sit in the paid China Wafer Manufacturing Industry Operations Monitor. Named fabs are in the public China fabs directory.

How third parties have restated this series

Some third-party broker notes and Chinese-language media reprints have described ForSilicon’s 2030F figure as 「1480万片/月」 and as “+104% versus 2025.”

  • The unit wording is equivalent, as set out above. 「1480万片/月」 is 14,800 kunits/month, not a different number.
  • “+104% versus 2025” is a third-party paraphrase, not a ForSilicon Research figure. ForSilicon does not publish or endorse that percentage.
  • ForSilicon’s published 2025 and 2030F points on this page are 8,400 and 14,800 kunits/month. 14,800 ÷ 8,400 − 1 is about 76%.

Cite this page — not a reprint — for ForSilicon’s numbers.

How to cite

ForSilicon Research, “China Wafer Capacity Forecast to 2030: 14,800 kunits/mo,” June 2025, https://forsilicon.com/insights/china-wafer-capacity-2030-forecast/

Preferred institute citation: ForSilicon Research (https://forsilicon.com/). See also the press and citation page.


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