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GHSMC
Hangzhou Global Semiconductor Manufacturing Co., Ltd. (杭州积海半导体有限公司) — Public profile for a China advanced packaging or OSAT company — English and Chinese names, business model, and links to ForSilicon packaging-capacity research.
Foundry
Basic information
- English full name
- Hangzhou Global Semiconductor Manufacturing Co., Ltd.
- Chinese full name
- 杭州积海半导体有限公司
- Business model
- Foundry
Why this profile matters
ForSilicon tracks China advanced packaging companies as part of its coverage of OSAT capacity, 2.5D / 3D and hybrid bonding, packaging WFE demand, and equipment and materials opportunities.
Use this profile to orient market development. For capacity, utilization, player share, and platform mix, follow the related ForSilicon products and free insights below.
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