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STIC
Semiconductor Technology Innovation Center (Beijing) Corp. (北方集成电路技术创新中心（北京）有限公司) — Public profile for a China advanced packaging or OSAT company — English and Chinese names, business model, and links to ForSilicon packaging-capacity research.
OSAT
Basic information
- English full name
- Semiconductor Technology Innovation Center (Beijing) Corp.
- Chinese full name
- 北方集成电路技术创新中心（北京）有限公司
- Business model
- OSAT
Why this profile matters
ForSilicon tracks China advanced packaging companies as part of its coverage of OSAT capacity, 2.5D / 3D and hybrid bonding, packaging WFE demand, and equipment and materials opportunities.
Use this profile to orient market development. For capacity, utilization, player share, and platform mix, follow the related ForSilicon products and free insights below.
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