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TFME
Tongfu Microelectronics Co., Ltd. (通富微电子股份有限公司) — Public profile for a China advanced packaging or OSAT company — English and Chinese names, business model, and links to ForSilicon packaging-capacity research.
OSAT
Basic information
- English full name
- Tongfu Microelectronics Co., Ltd.
- Chinese full name
- 通富微电子股份有限公司
- Business model
- OSAT
Why this profile matters
ForSilicon tracks China advanced packaging companies as part of its coverage of OSAT capacity, 2.5D / 3D and hybrid bonding, packaging WFE demand, and equipment and materials opportunities.
Use this profile to orient market development. For capacity, utilization, player share, and platform mix, follow the related ForSilicon products and free insights below.
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