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BaodingGanxin Integrated Circuit(Hangzhou) Co.,Ltd (宝鼎乾芯集成电路（杭州）有限公司) — Public profile for a China semiconductor fab — English and Chinese names, foundry or IDM model, listing details, and links to ForSilicon wafer-capacity and WFE research.
IDM · Non-memory
Basic information
- English full name
- BaodingGanxin Integrated Circuit(Hangzhou) Co.,Ltd
- Chinese full name
- 宝鼎乾芯集成电路（杭州）有限公司
- Business model
- IDM
- Product category
- Non-memory
- Listed status
- Private / unlisted
Why this profile matters
ForSilicon tracks China wafer manufacturing companies as part of its view of fab capacity, utilization, WFE spending, equipment demand, and supply-chain localization — including etch, deposition, CMP, lithography, and furnace demand tied to each expansion cycle.
Use this profile as a starting point for customer mapping. For capacity by wafer size, utilization, and WFE spend, follow the related ForSilicon products and free insights below.
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